SOUTHFIELD–The Engineering Society of Detroit will hold its Engineers Get Hired Job Fair on Wednesday, Nov. 1 at the Suburban Collection Showplace, 46100 Grand River Ave. in Novi. The event runs from 2 to 7 p.m.
Companies that reserve a booth by Friday, Oct. 6 will receive a complimentary postin on the ESD Job Bank, the region’s premier recruitment resource for the engineering and technology communities. That’s a $295 value.
Recruitment booths are $500 for ESD corporate members and $600 for non-members, with a $275 rate for government organization. That fee includes an 8-by-10-foot exhibit space with an 8-foot skirted and draped table and two chairs, free internet access, and lunch for up to five representatives at the table. Online promotion on www.esd.org, advertising in Michigan colleges and universities, and access to an exhibitor lounge is also included.
For jobseekers, the event is free for ESD members. For non-ESD members, the event is $20 before Oct. 17 and $25 thereafter. For new, first-time members, that registration includes a one-year membership to ESD. Jobseekers are encouraged to enter their resumes into the ESD Jobs Bank, jobs.esd.org.
The event regularly draws hundreds of jobseekers in engineering and related technical fields, from current students to experienced professionals.
For employers, that means people specifically tailored to their engineering and technology employment needs. For jobseekers, that means employers where theirtheir specific skills are in high demand. Internships and co-op opportunities will also be available for students.
Past job fairs have featured opportunities in aerospace, biofuels, biomedical engineering, chemical engineering, civil engineering, computer science, cyber security, defense, design, electrical engineering, energy, environmental engineering, finance, homeland security, human resources, manufacturing, materials science and engineering, mechanical engineering, mobility, operations and systems engineering, quality control, robotics, sales and marketing, scientific and technical communication, and surveying.